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KOSBON

Through the uniformity management of the solder-plating layer, flexibility and straightness of the ribbon for solar cell modules are promoted. KOSBON supports the high-speed module operation and CTM conversion efficiency at its best.

BASE MATERIAL AND DIMENSIONS

BASE MATERIAL AND DIMENSIONS

Material ETP-Cu
OF-Cu
UNS C11000 Cu ≥ 99.90%
UNS C10200 Cu ≥ 99.95%
UNS C10100 Cu ≥ 99.99%
Dimension Ribbon Thickness : 0.05 - 0.60mm
Width : 0.40 - 7.00mm
Tolerance : ± 5% of nominal dimension
Wire Diameter : 0.20 - 0.50mm
Tolerance : ± 2% of nominal diameter
Mechanical Properties
(Yield strength)
Ribbon : Down to 50MPa
Wire : Down to 80MPa

SOLDER COMPOSITION AND PROPERTIES

SOLDER COMPOSITION AND PROPERTIES

Composition Liquidus temp.(℃)
Unleaded Sn96.5Ag3.0Cu0.5 219
Sn62Bi38 180
Leaded Sn62Pb36Ag2 190
Sn60Pb40 190
Sn63Pb37 184

* Solder Thickness :10~40μm, Tolerance : +/- 5μm

PACKING

H type

Type D(mm) d(mm) w(mm) L(mm) h(mm) Net wt.(kg)
P-4 160 90 90 114 21 6
P-10S 152 102 102 122 16 5
DIN200 200 125 160 200 22 15
BS-1 270 150 92 106 52 15

Biconical type

Type D(mm) d(mm) w(mm) L(mm) h(mm) Net wt.(kg)
HKV160 160 90 85 150 22 7
HKV200 200 100 92 200 22 15